By Qingke Zhang
This thesis provides a sequence of mechanical try out equipment and comprehensively investigates the deformation and harm habit of Cu/Pb-free solder joints below various loading stipulations. The fracture habit of Pb-free joint interfaces triggered through rigidity, deformation of solder and substrate are proven, the shear fracture power of the Cu6Sn5 IMC is measured experimentally for the 1st time, and the dynamic harm technique and microstructure evolution habit of Pb-free solder joints are printed intuitively. The thesis places ahead the argument that the neighborhood cumulative harm is the key reason for failure in solder joints. The examine effects give you the experimental and theoretical foundation for bettering the reliability of solder joints.
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Extra resources for Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces
Example text
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7a1–a3 show the fracture process of the Cu6Sn5 grain shown in Fig. 6. During the initial deforming stage, the Cu6Sn5 grain deforms elastically, as in Fig. 7a1. When the load increases to a critical value, the Cu6Sn5 grain fractures at its center portion (see Fig. 7a2), inducing the first depth burst on the force–depth curve. As the fracture location is very close to the indentation location, the flexural torque on the fracture plane is little and the fracture should be induced by the shear stress.
