By Keith B. Schaub
Schaub and Kelly, either radio frequency (RF) technical experts, provide an in-depth review of RF and system-on-chip (SOC) product trying out for instant communications during this source for SOC purposes engineers, engineering managers, product engineers, and scholars. Early chapters introduce construction checking out, examine RF and SOC units, and talk about concerns regarding charges. those chapters might be specifically valuable for managers of technical groups. Later chapters are written as a instruction manual for purposes engineers, masking algorithms for construction checks played on discrete RF units, measurements used with extra hugely built-in SOC units, mixed-signal trying out, bettering try out potency, and size of noise.
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Extra resources for Production Testing of RF and System-on-a-Chip Devices for Wireless Communications
Example text
The higher the noise figure, the harder it will be for a device to receive lowlevel signals. With SOC devices, the all-encompassing term sensitivity is used because it is possible to measure their full functionality. For instance, it is possible to provide modulated RF signals to the SOC device. The device then processes the signal and produces either analog baseband signals (in-phase and quadrature-phase voltages) or digital data (bits) at the output. 11 consists of both transmitter and receiver functionality.
Mike Golio, Golio Consulting, personal communication to author, September 2003. 3. Typically, SOCs have lower volumes compared to DRAMs or MPUs. So, it is possible that due to economic reasons, many SOCs will not move to the more advanced processes. S. dollars (Rudy Garcia, NPTest, personal communication to author, September 27, 2003). 1 Chip Volume Increases with Wafer Dimensions Wafer Diameter Wafer Die per Increase from (in) Diameter Wafer Previous Size (mm) (%) 3 75 44 6 150 176 400 8 200 314 78 12 300 706 25 2 The table is normalized to a device that is 100 mm and does not consider the added benefit from shrinking technology.
There are some additional tests that may arise depending upon the specific design of the transceiver. A transceiver can have a common LO that is shared between the transmit and receive paths. When this is incorporated, it becomes necessary to test each chain for signals that may arise due to the other chain. Additionally, if any form of duplexing is used at the front end of the device, then it also becomes necessary to test for TX/RX leakage. As with either the SOC transmitter or SOC receiver, the signals coming from the non-RF end of the device may be either digital or analog.
